Quote:
Originally Posted by stretch289
What about using some form of 'potting compound' ?  That's effectivley what you're doing to the transistor and it'll probably seal the can back in place too. |
Potting Compounds tend to generate a fair bit of heat in curing. This is not a problem for most applications but I'm not so sure if this would be the case in this application. The heat would be quite concentrated on the junction and might alter the characteristics. This might not be a problem in most of the AF11* situations but is worth considering.
Regards,