[David G4EBT]

No!

There is a clear transparent protective film on each side of the UV film.

When you've cut the film to size, you have to put a small piece of sellotape on each side of the three-layer film and gently pull just one side off. (Doesn't matter which side peels off). Then you carefully apply the UV film to the laminate (with the second protective film stil in place), excluding air bubbles before putting it through the laminator to bond the film to the laminate.

If - when you've put it through the laminator there are any bubbles, you might as well peel off the protective film, clean off the UV film from the copper by asking it in acetone for a minute or two and have another go. The film is so cheap that it's only cost you your time!

After you've exposed the PCB, you then peel off the second sheet of protective film before developing the PCB. The developer dissolves all the areas that were not exposed to UV - all the areas (tracks, pads, ground planes etc) that received UV light will remain in place as the 'etch resist'. This is of course the opposite of positive UV.

It's a bit of a knack to peel the protective film off, but you get the hang of it after a few goes. It doesn't matter which side you peel off first.

(There are videos on YouTube).

Hope that helps.

Good luck with it.