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Old 7th Dec 2017, 3:11 pm   #16
Welsh Anorak
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Join Date: Apr 2005
Location: North Wales, UK.
Posts: 3,832
Default Re: Surface mount parts- RIP. (Rest in Place)

I've always found that introducing glue under an SMD IC is a mistake as it causes the chip to be too high. Like Sirius above, I find if the pads are completely clean the IC will sit square on them. A small blob on one corner (assuming a quad) then a little manipulation with the tweezers and a blob on the opposite corner and then the solder will take. If the pins are even fractionally above the pads then you can't do a good job. And what if you need to remove the new IC?
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